Committee Prof. Madhavan Swaminathan – School of Electrical Engineering (co-advisor) Prof. Mark Losego – School of Materials Science and Engineering (co-advisor) Prof. Mohanalingham Kathaperumal – School of Electrical Engineering Abstract       This body of work, in detail, outlines the fundamental steps taken to characterize a material for novel use in RDL build-up layers for advanced packaging. The material (Zaristo-700) discussed in this thesis was only used in RF applications, and now we are exploring its use in the wiring layers. In the PRC, research into thin films, spin-on films, and many other dielectrics have been published before. It is essential to understand that this work is necessary to establish a “library” or catalog of information on all the materials we use to provide the correct material, depending on the goals of future projects. The material and electrical properties of Zaristo-700 are characterized through JEDEC adhesion testing (Peel test), leakage current measurements on ITO glass slides before and after Highly Accelerated Stress Testing (HAST) treatment, a series of dose tests to document the most optimized pitch-scalability at 8.0 m L/S, and lastly Shadow-Moire warpage studies of one layer and three-layer RDL samples. Leakage current measurements taken before and after HAST stayed at or below 2.0 nA. As we will explore, the CTE and adhesion of Zaristo-700 are excellent and contribute to making a great material for the RDL wiring layers. Taiyo Ink. has stated that this version of the dielectric film accounts for issues such as stability in how long it can sit, delamination during or after curing, delamination during fabrication processes, and so on. Whereas some of the dielectric films of other companies still have these problems. This research is working towards answering the unknowns about this dielectric and how well it will function as a future RDL build-up material through characterization and analysis of its properties. These results are a positive indication for use as an RDL dielectric in advanced packaging.