MSE Ph.D. student Pratik Nimbalkar received Best Interactive Presentation Award at the IEEE Electronic Components and Technology Conference (ECTC) in San Diego, the premier international event that brings together the best in packaging, components and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Nimbalkar, advised by Rao Tummala and Madhavan Swaminathan, received the award for the paper “Novel Zero Side-Etch Process for <1μm Package Redistribution Layers.”  The paper presents a new process developed at Georgia Tech Packaging Research Center to accurately control the dimensions of package redistribution layers leading to 1-micrometer redistribution wiring that is state-of-the-art in advanced package substrates. The poster authors were Pratik Nimbalkar, Pragna Bhaskar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, and Rao Tummala.

 The award will be recognized at the IEEE 73rd ECTC in Orlando, FL. in June.